三鑫新材料有限公司, 有限公司: 先进陶瓷领域的世界领先者 2008 年, 专业生产陶瓷研磨介质, 采矿业的耐磨零件和结构部件, 电子的, 制药, 航空航天和其他行业.
三鑫新材料有限公司, 有限公司: 先进陶瓷领域的世界领先者 2008 年, 专业生产陶瓷研磨介质, 采矿业的耐磨零件和结构部件, 电子的, 制药, 航空航天和其他行业.
Silicon nitride ceramic heating tablets are heating elements made from silicon nitride ceramic materials that can withstand high temperatures and thermal shock. They are commonly used in industrial heating applications such as furnaces and kilns, and offer high efficiency, fast heating rates, and long service life.
Silicon nitride ceramic heating tablets are a type of heating element used in various industrial and scientific applications. These tablets are made of a high-strength ceramic material known as silicon nitride, which has excellent thermal properties and can withstand high temperatures without deformation or cracking.
Silicon nitride ceramic heating tablets are typically designed as thin, flat plates or discs that are heated by passing an electric current through them. They can be used in a variety of heating applications, such as in industrial furnaces, semiconductor processing, and laboratory equipment.
One of the key advantages of silicon nitride ceramic heating tablets is their rapid heating and cooling capabilities. They can heat up to their maximum temperature within seconds and can cool down just as quickly. This makes them ideal for applications that require precise temperature control and fast heating and cooling cycles.
Silicon nitride ceramic heating tablets are also highly resistant to corrosion, oxidation, and chemical attack, making them suitable for use in harsh environments. Additionally, they have a long lifespan and require minimal maintenance, making them a cost-effective heating solution.
Properties Compare with Si3N4 Ceramics and SiC Ceramics:
| Item | Unit | 氮化硅 | 碳化硅 |
| Density | g/cm3 | 3.23 | 3.1 |
| Porosity | % | 0 | 0 |
| Color | / | Black | Black |
| Flexural Strength | 兆帕 | 720 | 550 |
| Elastic Modulus | Gpa | 300 | 410 |
| Poisson’s Ratio | / | 0.26 | 0.14 |
| Compressive Strength | 兆帕 | 2300 | 3900 |
| Fracture Toughness KIC | Mpa.m1/2 | 6.2 | 4.6 |
| Max. Using Temperature (unload) | ℃ | 1050 | 1650 |
| Coefficient of Thermal Expansion | 10-6/℃ | 3.2 | 4.0 |
| Thermal Conductivity | W/m.K | 25 | 120 |
| Volume Resistivity | Ω.mm2/m | >1013 | 102-106 |
